The Future of Through-Hole Technology - Circuits Assembly
WEBFeb 1, 2017 · Through-hole technology was dominant for years in electronics assembly until surface mount technology became available in the 1980s. Today, the majority of components in a product are surface-mount packages. About 5% of components in commercial products are PTH components, and about 10 to 15% of components used for aerospace applications are ...
Pine Electronics Invests in Quality with PARMI Xceed 3D AOI
WEBJan 9, 2020 · The PARMI Xceed New Generation 3D AOI will enable Pine Electronics to improve its processes and product quality in terms of component placing and soldering quality. The Xceed's high-speed CMOS camera with dual-laser technology can easily identify missing, lifted, misaligned and tomb-stoned components, as well as checking polarity of all devices.
Circuits Assembly Online Magazine - Closed-Loop Process …
WEBSep 4, 2023 · Printed circuit board assembly requires extraordinary precision and repeatability. The screen printing process is considered the most critical process in the surface mount technology (SMT) assembly process. According to some studies, 70% of SMT defects can be traced back to the screen printing process (FIGURE 1). Component miniaturization has made this process more critical.
Naprotek Acquires MicroFab in EMS Rollup - Circuits Assembly
WEBPublished: 09 August 2022. by Mike Buetow. SAN JOSE -- Naprotek has completed the acquisition of privately held MicroFab, adding RF products and services to its electronics manufacturing mix. The business and entire MicroFab team will be integrated into the East Coast operations at SemiGen, which Naprotek acquired last fall.
WEBThe compliant mechanism in the pin compresses when the pressing tool forces the contact into a PCB hole. This compliance relaxes hole size tolerance, helps. FIGURE 1: Compliant press-fit pins: C-section (top left), action pin (bot-tom left) and eye of the needle (right). FIGURE 2: PC-controlled servo-electric presses precisely control the speed ...
Clarifying Through-Hole Fill Levels - Circuits Assembly
WEBOct 22, 2019 · At present, through-hole joint fill requirements and inspection criteria are commonly identified and understood within the J-STD-001/IPC-A-610 specifications. Those indicate Class II/III assemblies should have at least 75% fill, based on the through-hole depth. An oblique angle view x-ray clearly shows the nature and depth of the fill ...
CALCE Releases Free CalceSARA Physics-of-Failure Software
WEBPublished: 08 May 2020. CalceSARA software uses physics-of-failure-based reliability principles to assess time to failure of part/system/failure site. Use this information to develop customized test plans and compare competing designs. Identify failure modes and rank failures by time to failure under different loading conditions.
Dixon Technologies Reports Doubled Quarterly Revenue
WEBJul 30, 2024 · Dixon Technologies saw year-over-year revenue grow by 101% for the first quarter of its fiscal year, totaling INR65.8 billion ($758.8 million).
Yes, J-STD-001 and IPC-A-610 Can Be Used Together - Circuits …
WEBMay 8, 2019 · Using the two documents together can be rewarding, but to do so successfully requires knowledge and vigilance. As an aside, IPC will host a pair of technical education courses, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, on Sept. 10 in Huntsville, AL, and on Dec. 3 in Anaheim, CA.
Circuits Assembly Online Magazine - 2022 Magazine Archives
WEBSeptember 2022. Why I4.0 and reshoring go hand in hand. A no-flux reflow process for vacuum soldering. Ensuring proper alignment of layers and components on a PCB. The SMTAI Womenâ s Leadership Program. Lean manufacturing and program management.